DocumentCode
1149102
Title
Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D)
Author
Seaman, M.E. ; Economikos, Laertis ; Lambright, Julius
Author_Institution
IBM Corp., Hopewell Junction, NY, USA
Volume
17
Issue
3
fYear
1994
fDate
8/1/1994 12:00:00 AM
Firstpage
291
Lastpage
299
Abstract
Computer vision techniques have been developed and implemented for automatic optical inspection (AOI) of multichip modules with thin films. A case study, detailing the application of the techniques based on an Orbot TF501 visual inspection system platform for a high density grid of circular pads, is presented. The techniques presented here are capable of detecting electrical and non-electrical defects such as near shorts, wrong metallurgy, contamination, etc
Keywords
automatic optical inspection; computer vision; multichip modules; AOI; MCM inspection; MCM-D; Orbot TF501; automatic inspection; circular pads; computer vision; electrical defects; high density grid; multi-chip modules; nonelectrical defects; thin films; visual inspection system platform; Atherosclerosis; Automatic optical inspection; Computer vision; Investments; Optical films; Optical sensors; Printed circuits; Substrates; Testing; Voltage;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.311776
Filename
311776
Link To Document