Title :
Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D)
Author :
Seaman, M.E. ; Economikos, Laertis ; Lambright, Julius
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
fDate :
8/1/1994 12:00:00 AM
Abstract :
Computer vision techniques have been developed and implemented for automatic optical inspection (AOI) of multichip modules with thin films. A case study, detailing the application of the techniques based on an Orbot TF501 visual inspection system platform for a high density grid of circular pads, is presented. The techniques presented here are capable of detecting electrical and non-electrical defects such as near shorts, wrong metallurgy, contamination, etc
Keywords :
automatic optical inspection; computer vision; multichip modules; AOI; MCM inspection; MCM-D; Orbot TF501; automatic inspection; circular pads; computer vision; electrical defects; high density grid; multi-chip modules; nonelectrical defects; thin films; visual inspection system platform; Atherosclerosis; Automatic optical inspection; Computer vision; Investments; Optical films; Optical sensors; Printed circuits; Substrates; Testing; Voltage;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
