The WASP3 monolithic-WSI massively parallel processor

Author

Jalowiecki, I.P.

Author_Institution

Dept. of Electr. Eng. & Electron., Brunel Univ., Uxbridge

Volume

17

Issue

3

fYear

1994

fDate

8/1/1994 12:00:00 AM

Firstpage

318

Lastpage

323

Abstract

The ASP (Associative String Processor) is a massively parallel fault tolerant associative processor designed for the implementation of extensible parallel processing systems. This paper describes the WASP3 processor, which is an implementation of an ASP processor array, comprising a large monolithic silicon device (5.5 cm×5.5 cm) hybridized with a bonded-silicon High Density Interconnect (HDI), which has been developed to provide a reliable interconnection medium for Wafer Scale Integration (WSI) devices. The HDI supports multi-layer, passive interconnect, providing superior electrical and noise properties for the distribution of power and signal, and allowing the WSI device to achieve improved logic density by reducing monolithic tracking overheads

Keywords

VLSI; fault tolerant computing; microprocessor chips; parallel processing; WASP3 processor; associative string processor; bonded-silicon high density interconnect; extensible parallel processing systems; logic density; massively parallel fault tolerant associative processor; monolithic tracking overheads; monolithic-WSI massively parallel processor; noise properties; passive interconnect; Application specific processors; Fault tolerant systems; Noise reduction; Parallel processing; Power system interconnection; Power system reliability; Process design; Silicon devices; Wafer bonding; Wafer scale integration;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.311780

Filename

311780