• DocumentCode
    1149166
  • Title

    3D-WASP devices for on-line signal and data processing

  • Author

    Hedge, S.J. ; Habiger, C.M. ; Lea, R.M.

  • Author_Institution
    Aspex Microsystems Ltd., Brunel Univ., Uxbridge, UK
  • Volume
    17
  • Issue
    3
  • fYear
    1994
  • fDate
    8/1/1994 12:00:00 AM
  • Firstpage
    324
  • Lastpage
    333
  • Abstract
    While hybrid and monolithic Wafer-Scale Integration (WSI) technologies have brought about dramatic improvements in the density of integration of embedded massively parallel computers (MPCs), systems and applications engineers continue to demand ever more processing power in less space. The emerging technology of 3D-WSI offers a way of meeting this challenge, giving the potential for step-function increases in parallelism using existing WSI package options. It also permits independent scaling of I/O, parallel processing power and control, leading to a degree of cost-effectiveness that conventional 2D-WSI cannot match. The paper explores the potential of 3D-WASP (WSI Associative String Processor) and reports the results of a study into the engineering feasibility of such a device. This study suggests that a single 3D-WASP device, packages in a standard 2.5"×2.5"×0.25" can could deliver 100 Giga-OPS performance form 65536 processing elements, provide up to 64 input-output data channels of 16 bits each and dissipate only 25 W
  • Keywords
    VLSI; digital signal processing chips; packaging; parallel architectures; 0.25 in; 16 bit; 2.5 in; 25 W; 3D-WASP devices on-line signal processing on-line data processing massively parallel computers Wafer-Scale Integration 3D-WSI package WSI Associative String Processor 100 Giga-OPS input-output data channels; Concurrent computing; Data processing; Embedded computing; Packaging; Parallel processing; Power engineering and energy; Power engineering computing; Signal processing; Space technology; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.311781
  • Filename
    311781