A computer aided design tool for robust multichip module package design

A novel methodology for design assessment of MCM packages is presented using finite element analysis and a Taguchi based design of experiments technique. This methodology enables the design engineer to rapidly estimate the quality of candidate designs and thereby select better designs. The proposed method allows the designer to generate a robust finite element model of the physical process which is also numerically efficient, to identify the design parameters that are critically important to the performance of the design and also to investigate the effect of tolerances on the significant design parameters. A detailed description of the methodology is presented along with a MCM design example to illustrate the proposed method