DocumentCode :
1149279
Title :
High frequency modeling and characterization of high performance DFB laser modules
Author :
Delpiano, F. ; Paoletti, R. ; Audagnotto, P. ; Puleo, M.
Author_Institution :
CSELT, Torino, Italy
Volume :
17
Issue :
3
fYear :
1994
fDate :
8/1/1994 12:00:00 AM
Firstpage :
412
Lastpage :
417
Abstract :
The paper describes the high frequency design of DFB laser transmitter modules with modulation bandwidth in excess of 10 GHz, manufactured and tested for coherent optical transmission experiments. The method is based on a previous conventional small-signal analysis of the parasitics (package and laser chip) and the active region dynamics, solving the two associated equivalent circuits by comparing, respectively, the measured electrical reflection and optical noise responses to the corresponding computed microwave simulations, Then, suitably combining the two circuits, the complete and independent model of the transmitter module is derived, which allows the final, more precise and complete determination of any circuit element with simulated modulation responses in good agreement with the experimental results. Finally, an example of optimization of the package high frequency performance, carried out by the aid of the developed model, and supported by a time-domain reflection analysis, is presented
Keywords :
distributed feedback lasers; equivalent circuits; modules; optical communication equipment; optical modulation; packaging; semiconductor device models; semiconductor lasers; transmitters; 10 GHz; DFB laser modules; HF characterization; active region dynamics; coherent optical transmission experiments; electrical reflection; equivalent circuits; high frequency design; high frequency modeling; laser transmitter modules; microwave simulation; optical noise responses; parasitics; small-signal analysis; time-domain reflection analysis; Analytical models; Circuit simulation; Computational modeling; Frequency; Laser modes; Microwave circuits; Optical noise; Optical reflection; Optical transmitters; Packaging;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.311791
Filename :
311791
Link To Document :
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