Title :
Design optimization and finite element analysis of AlN/3C-SiC piezoelectric bio-sensors
Author :
Iqbal, Azlan ; Mohd-Yasin, Faisal ; Dimitrijev, Sima
Author_Institution :
Queensland Micro- & Nanotechnol. Centre, Griffith Univ., Brisbane, QLD, Australia
Abstract :
In this paper we present the design and simulation of a bio-sensor for pathogens detection based on AlN/3C-SiC/Si piezoelectric cantilever. Cubic silicon carbide (3C-SiC) is chosen as the base layer due to its excellent material properties and chemical inertness over silicon in harsh environmental conditions. Aluminum nitride (AlN) is selected as piezoelectric active layer due to its similar thermal expansion coefficient with silicon carbide to reduce thermal stress. The desired resonant frequency of 157.16 KHz is optimized using Matlab and the finite element analysis is carried out using COMSOL software to verify the shift in the resonant frequency due to the added mass of the bacteria. The surface functionalizations of the SiC as biosensor, as well as the fabrication recipes are also proposed.
Keywords :
aluminium compounds; biosensors; cantilevers; elemental semiconductors; finite element analysis; mathematics computing; microorganisms; optimisation; piezoelectric devices; silicon; silicon compounds; thermal expansion; thermal stresses; wide band gap semiconductors; AlN-3C-SiC piezoelectric biosensors; AlN-3C-SiC-Si piezoelectric cantilever; AlN-SiC-Si; COMSOL software; Matlab; base layer; chemical inertness; cubic silicon carbide; design optimization; finite element analysis; frequency 157.16 kHz; harsh environmental conditions; material properties; pathogens detection; piezoelectric active layer; resonant frequency; surface functionalizations; thermal expansion coefficient; thermal stress; Biosensors; III-V semiconductor materials; Resonant frequency; Silicon; Silicon carbide; Structural beams; 3C-SiC; Extreme environment; Microresonator; Pathogens; Piezoelectric; Si;
Conference_Titel :
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location :
Kuala Lumpur
DOI :
10.1109/SMELEC.2014.6920910