• DocumentCode
    1151760
  • Title

    SOI design for competitive CMOS VLSI

  • Author

    Fossum, Jerry G. ; Choi, Jin-young ; Sundaresan, Ravishankar

  • Author_Institution
    Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
  • Volume
    37
  • Issue
    3
  • fYear
    1990
  • fDate
    3/1/1990 12:00:00 AM
  • Firstpage
    724
  • Lastpage
    729
  • Abstract
    Device simulations using a physical SOI MOSFET model implemented in SPICE2 predict that properly designed silicon-on-insulator (SOI) has a substantial advantage over bulk CMOS VLSI with regard to hot-carrier-induced degradation. The simulations show that the (short-) n-channel SOI MOSFET, designed with moderately thin (not ultrathin) film having complete depletion in the film and at the back surface, and without an LDD region, will degrade much more slowly than a contemporary bulk MOSFET with an LDD. This suggests that the 5-V source can be retained for submicrometer SOI CMOS, whereas it must be lowered for bulk CMOS. The simulations and the optimal SOI designs they suggest are supported by measurements of thin-film and bulklike MOSFETs fabricated in SIMOX SOI
  • Keywords
    CMOS integrated circuits; VLSI; electronic engineering computing; hot carriers; insulated gate field effect transistors; semiconductor device models; semiconductor-insulator boundaries; SIMOX SOI; SPICE2; Si on insulator; device simulation; hot-carrier-induced degradation; optimal SOI designs; physical SOI MOSFET model; CMOS technology; Degradation; Hot carriers; Isolation technology; MOSFET circuits; Predictive models; Semiconductor device modeling; Silicon on insulator technology; Transistors; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.47778
  • Filename
    47778