• DocumentCode
    1152853
  • Title

    Fabrication and performance of high moment laminated FeAlN thin film inductive recording heads

  • Author

    Wang, S. ; Liu, F. ; Maranowski, K.D. ; Kryder, M.H.

  • Author_Institution
    Data Storage Syst. Center, Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    30
  • Issue
    2
  • fYear
    1994
  • fDate
    3/1/1994 12:00:00 AM
  • Firstpage
    281
  • Lastpage
    286
  • Abstract
    Experimental thin film inductive heads using previously developed laminated FeAlN high moment soft magnetic materials have been designed, and fabricated to the wafer level. The heads, with a gap length of 0.2 μm and trackwidths varying from 6 to 84 μm, were fabricated with a mainly dry process. The dynamic domain patterns of the top magnetic poles were observed with a high speed wide-field Kerr microscope. Closure domains were not present, while multiple easy-axis domains were observed in the head yokes. The head inductances were measured from 1 to 50 MHz with a network analyzer. The electrical and magnetic testing results show that the fabricated heads function well at the wafer level and that laminated FeAlN high moment material is a very promising candidate for future high-density recording head applications
  • Keywords
    aluminium alloys; ferromagnetic properties of substances; iron alloys; magnetic domains; magnetic heads; magnetic moments; magnetic thin film devices; 0.2 micron; 1 to 50 MHz; 6 to 84 micron; FeAlN; dry process; dynamic domain patterns; gap length; head yokes; high moment soft magnetic materials; laminated FeAlN materials; multiple easy-axis domains; network analyzer; thin film inductive recording heads; trackwidths; wafer level; wide-field Kerr microscope; Fabrication; Magnetic analysis; Magnetic domains; Magnetic films; Magnetic force microscopy; Magnetic heads; Magnetic materials; Magnetic recording; Materials testing; Soft magnetic materials;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.312273
  • Filename
    312273