• DocumentCode
    1153208
  • Title

    Dual-Material-Gate Technique for Enhanced Transconductance and Breakdown Voltage of Trench Power MOSFETs

  • Author

    Saxena, Raghvendra S. ; Kumar, M. Jagadesh

  • Author_Institution
    Dept. of Electr. Eng., Indian Inst. of Technol., New Delhi
  • Volume
    56
  • Issue
    3
  • fYear
    2009
  • fDate
    3/1/2009 12:00:00 AM
  • Firstpage
    517
  • Lastpage
    522
  • Abstract
    In this brief, we propose a new dual-material-gate-trench power MOSFET that exhibits a significant improvement in its transconductance and breakdown voltage without any degradation in on-resistance. In the proposed structure, we have split the gate of a conventional trench MOSFET structure into two parts for work-function engineering. The two gates share the control of the inversion charge in the channel. By using 2-D numerical simulation, we have shown that by adjusting the lengths of the two gates to allow equal share of the inversion charge by them, we get the optimum device performance. By using N+ poly-Si as a lower gate material and P+ poly-Si as an upper gate material, approximately 44% improvement in peak transconductance and 20% improvement in breakdown voltage may be achieved in the new device compared to the conventional trench MOSFET.
  • Keywords
    elemental semiconductors; power MOSFET; semiconductor device breakdown; semiconductor device models; silicon; work function; 2D numerical simulation; N+ poly-Si lower gate material; P+ poly-Si upper gate material; Si; breakdown voltage; dual-material-gate technique; inversion charge; on-resistance; transconductance; trench power MOSFET; work-function engineering; Automotive electronics; Conducting materials; Degradation; MOSFETs; Microprocessors; Numerical simulation; Power engineering and energy; Switching converters; Transconductance; Voltage; Breakdown voltage; dual material gate; on-resistance; power MOSFET; trench gate;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2008.2011723
  • Filename
    4781546