DocumentCode
1153208
Title
Dual-Material-Gate Technique for Enhanced Transconductance and Breakdown Voltage of Trench Power MOSFETs
Author
Saxena, Raghvendra S. ; Kumar, M. Jagadesh
Author_Institution
Dept. of Electr. Eng., Indian Inst. of Technol., New Delhi
Volume
56
Issue
3
fYear
2009
fDate
3/1/2009 12:00:00 AM
Firstpage
517
Lastpage
522
Abstract
In this brief, we propose a new dual-material-gate-trench power MOSFET that exhibits a significant improvement in its transconductance and breakdown voltage without any degradation in on-resistance. In the proposed structure, we have split the gate of a conventional trench MOSFET structure into two parts for work-function engineering. The two gates share the control of the inversion charge in the channel. By using 2-D numerical simulation, we have shown that by adjusting the lengths of the two gates to allow equal share of the inversion charge by them, we get the optimum device performance. By using N+ poly-Si as a lower gate material and P+ poly-Si as an upper gate material, approximately 44% improvement in peak transconductance and 20% improvement in breakdown voltage may be achieved in the new device compared to the conventional trench MOSFET.
Keywords
elemental semiconductors; power MOSFET; semiconductor device breakdown; semiconductor device models; silicon; work function; 2D numerical simulation; N+ poly-Si lower gate material; P+ poly-Si upper gate material; Si; breakdown voltage; dual-material-gate technique; inversion charge; on-resistance; transconductance; trench power MOSFET; work-function engineering; Automotive electronics; Conducting materials; Degradation; MOSFETs; Microprocessors; Numerical simulation; Power engineering and energy; Switching converters; Transconductance; Voltage; Breakdown voltage; dual material gate; on-resistance; power MOSFET; trench gate;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2008.2011723
Filename
4781546
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