Title :
A 3-D Low Jitter and Skew Clock Distribution Network Scheme Using LTCC Package Level Interposer With a Planar Cavity Resonator
Author :
Lee, Woojin ; Kim, Jaemin ; Ryu, Chunghyun ; Park, Jongbae ; Kim, Jun Chul ; Kim, Joungho
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci. (EECS), Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
Abstract :
In this paper, we propose a new three-dimensional (3-D) clock distribution network (CDN) scheme using a low temperature co-fired ceramic (LTCC) package level interposer with a planar cavity resonator to achieve extremely low jitter and skew clock delivery even in severe power supply noise environments, especially for digital chips in 3-D stacked chip packages. It is based on a uniform-phase of the standing wave at the quarter-wavelength planar cavity resonator embedded inside the LTCC interposer. Substantial suppression of the timing jitter and skew was successfully demonstrated through a series of design, fabrication, and measurement processes of test devices and packages.
Keywords :
cavity resonators; ceramic packaging; clocks; distribution networks; integrated circuit packaging; jitter; microwave integrated circuits; timing jitter; LTCC interposer; digital chips; low temperature co-fired ceramic package interposer; power supply noise environments; quarter-wavelength planar cavity resonator; skew clock delivery; standing wave uniform phase; three-dimensional clock distribution network; timing jitter suppression; 3-D stacked chip package; Clock distribution; interposer; jitter; quarter-wavelength resonance; skew;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2009.2024841
