Title :
Sensor for monitoring the rinsing of patterned wafers
Author :
Yan, Jun ; Seif, Dan ; Raghavan, Srinivas ; Vermeire, Bert ; Barnaby, Hugh J. ; Peterson, Tom ; Shadman, Farhang
Author_Institution :
Dept. of Chem. & Environ. Eng., Univ. of Arizona, Tucson, AZ, USA
Abstract :
Developing efficient wafer cleaning and rinsing requires technology for on-line monitoring of the wafer cleanliness. An electrochemical sensor is designed, fabricated, and tested to measure the concentration of residual contaminants on the wafer surface during the rinse process. The sensor is based on the real time and in situ measurement of electrical impedance across a trench microstructure. The sensor´s output signal is proportional to the concentration of impurities remaining in the trench and, therefore, is a measure of the progress of the rinse in cleaning the wafer surface. Electrical measurements, circuit analysis, and direct testing of the device at known impurity levels are used to select and design a suitable sensor configuration. The results confirm the feasibility and sensitivity of the device applicable to typical wafer rinsing conditions.
Keywords :
electric impedance; electrical resistivity; electrochemical sensors; impurity distribution; impurity states; surface cleaning; surface contamination; circuit analysis; device feasibility; device sensitivity; device testing; electrical impedance; electrical measurements; electrochemical sensor design; electrochemical sensor fabrication; electrochemical sensor testing; impurity concentration; impurity levels; in situ measurement; on-line wafer monitoring; patterned wafer surface rinsing; real time measurement; residual surface contaminants; sensor configuration; sensor output signal; surface cleaning; trench microstructure; wafer cleaning; Circuit testing; Cleaning; Electric variables measurement; Impedance measurement; Impurities; Microstructure; Monitoring; Pollution measurement; Surface contamination; Surface impedance; 65; Contamination; semiconductor sensor; wafer rinsing;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2004.837001