DocumentCode :
115403
Title :
Sensory substitution using 3-degree-of-freedom tangential and normal skin deformation feedback
Author :
Quek, Zhan Fan ; Schorr, Samuel ; Nisky, Ilana ; Provancher, William ; Okamura, Allison M.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
fYear :
2014
fDate :
23-26 Feb. 2014
Firstpage :
27
Lastpage :
33
Abstract :
During manual interactions, we experience both kinesthetic forces and tactile sensations. Friction and normal force between the fingerpads and the tool/interaction surfaces cause shear and normal deformation of the skin. Capitalizing on this observation, we designed a 3-degree-of-freedom (DoF) tactile device that is grasped by a user and can render both tangential skin stretch and normal deformation on the skin of the user´s fingerpads. Tactile feedback from the device is delivered in a manner consistent with natural tactile cues from manual interaction. An experiment assessed the accuracy with which users can locate the center of a contoured hole on a virtual surface. The task was completed under four conditions: the cases of skin deformation and force feedback, with both 3- and 1-DoF feedback in each case. With 3-DoF feedback, users located the hole faster and more accurately than with 1-DoF feedback, for both force and skin deformation feedback. These results indicated that users were able to interpret the additional DoF cues provided by our 3-DoF tactile device to improve task performance.
Keywords :
feedback; shear deformation; tactile sensors; 1DoF feedback; 3-DoF feedback; 3-DoF tactile device; 3-degree-of-freedom tactile device; 3-degree-of-freedom tangential feedback; fingerpads; force feedback; friction; hole; kinesthetic forces; manual interaction; normal deformation; normal skin deformation feedback; sensory substitution; shear deformation; tactile feedback; tactile sensations; tangential skin stretch; user fingerpad; virtual surface; Apertures; Force; Force feedback; Friction; Kinematics; Skin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Haptics Symposium (HAPTICS), 2014 IEEE
Conference_Location :
Houston, TX
Type :
conf
DOI :
10.1109/HAPTICS.2014.6775429
Filename :
6775429
Link To Document :
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