Title :
SMT-compatibility of adhesive flip chip on foil interconnections with 40-μm pitch
Author :
De Vries, Hans ; Van Delft, Jan ; Slob, Kees
Author_Institution :
Philips Center for Ind. Technol., Eindhoven, Netherlands
Abstract :
The manufacturing and reliability of a novel type of first-level interconnections is described. Anisotropic conductive and nonconductive adhesives are used to electrically bond flip chip ICs with a pitch of 60 and 40 μm to flexible substrates. Analyses cover the initial state of the samples as well as their performance in the JEDEC moisture sensitivity level assessment and subsequent life testing. From the different behavior of the two types of adhesives a failure mechanism issues for the reflow-soldering test.
Keywords :
adhesives; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; integrated circuit reliability; life testing; reflow soldering; surface mount technology; 40 micron; 60 micron; SMT compatibility; adhesive flip chip; anisotropic conductive adhesive; electrical bond; endurance test; failure mechanism; flexible substrates; flip chip integrated circuit; flip-chip-on-foil; foil interconnection; life testing; moisture sensitivity level assessment; nonconductive adhesive; reflow-soldering test; Assembly; Bonding; Contact resistance; Failure analysis; Flip chip; Manufacturing; Moisture; Nonconductive adhesives; Reflow soldering; Testing; Anisotropic conductive adhesive (ACA); endurance test; failure mechanism; flip-chip-on-foil; moisture sensitivity level assessment (MSLA); nonconductive adhesive (NCA); reflow soldering;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2005.848568
