SMT-compatibility of adhesive flip chip on foil interconnections with 40-μm pitch

Author

De Vries, Hans ; Van Delft, Jan ; Slob, Kees

Author_Institution

Philips Center for Ind. Technol., Eindhoven, Netherlands

Volume

28

Issue

3

fYear

2005

Firstpage

499

Lastpage

505

Abstract

The manufacturing and reliability of a novel type of first-level interconnections is described. Anisotropic conductive and nonconductive adhesives are used to electrically bond flip chip ICs with a pitch of 60 and 40 μm to flexible substrates. Analyses cover the initial state of the samples as well as their performance in the JEDEC moisture sensitivity level assessment and subsequent life testing. From the different behavior of the two types of adhesives a failure mechanism issues for the reflow-soldering test.

Keywords

adhesives; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; integrated circuit reliability; life testing; reflow soldering; surface mount technology; 40 micron; 60 micron; SMT compatibility; adhesive flip chip; anisotropic conductive adhesive; electrical bond; endurance test; failure mechanism; flexible substrates; flip chip integrated circuit; flip-chip-on-foil; foil interconnection; life testing; moisture sensitivity level assessment; nonconductive adhesive; reflow-soldering test; Assembly; Bonding; Contact resistance; Failure analysis; Flip chip; Manufacturing; Moisture; Nonconductive adhesives; Reflow soldering; Testing; Anisotropic conductive adhesive (ACA); endurance test; failure mechanism; flip-chip-on-foil; moisture sensitivity level assessment (MSLA); nonconductive adhesive (NCA); reflow soldering;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2005.848568

Filename

1501951