DocumentCode
1156576
Title
Development of an end-point detector for parylene deposition process
Author
Sutomo, Wongso ; Wang, Xuefeng ; Bullen, David ; Braden, Sarah K. ; Liu, Chang
Author_Institution
Nanotechnology Lab., Univ. of Illinois, Champaign, IL, USA
Volume
12
Issue
1
fYear
2003
fDate
2/1/2003 12:00:00 AM
Firstpage
64
Lastpage
69
Abstract
Parylene is an emerging material for MEMS. It is an organic material that is grown by using the chemical vapor deposition method at room temperature. The deposition thickness is commonly controlled by the amount of solid-phase dimer loaded in a sublimation chamber. In a conventional deposition machine, the end point of the process is designated by the moment the dimer is exhausted. However, this end-of-process criterion does not offer precise, repeatable control of film thickness. We present the results of the development of an in situ end-point detector for a Parylene chemical vapor deposition process. The detector is based on the thermal transfer principle and can be implemented on commercial parylene deposition systems with minimal system modification. Such a sensor enables a user to stop the deposition when a targeted thickness is reached. The end point detector is very simple to implement on existing parylene deposition systems. A series of such sensors with different target deposition thickness would allow extraction of the actual deposition rate within a deposition run.
Keywords
chemical vapour deposition; micromechanical devices; polymer films; sublimation; MEMS; chemical vapor deposition method; deposition thickness; end-point detector; organic material; parylene; solid-phase dimer; sublimation chamber; thermal transfer principle; Chemical sensors; Chemical vapor deposition; Control systems; Detectors; Dielectric materials; Laboratories; Micromechanical devices; Semiconductor materials; Temperature; Thickness control;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2002.807473
Filename
1183743
Link To Document