Temperature uniformity in RTP furnaces

Author

Sorrell, F. Yates ; Fordham, Mark J. ; Öztürk, Mehmet C. ; Wortman, Jimmie J.

Author_Institution

North Carolina State Univ., Raleigh, NC, USA

Volume

39

Issue

1

fYear

1992

fDate

1/1/1992 12:00:00 AM

Firstpage

75

Lastpage

80

Abstract

The heat transfer to a wafer in a rapid thermal processing (RTP) furnace is simulated by an analytical/numerical model. The model includes radiation heat transfer to the wafer from the lamps, heat conduction within the wafer, and emission of radiation from the wafer. Geometric optics are used to predict the radiant heat flux distribution over the wafer. The predicted wafer surface temperature distribution is compared to measurements made in an RTP furnace for two different reflector geometries. Lamp configurations and the resulting irradiance required to produce a uniform wafer temperature are defined

Keywords

furnaces; heat conduction; heat radiation; incoherent light annealing; semiconductor technology; temperature distribution; RTP furnaces; geometric optics; heat conduction; irradiance; lamp configurations; numerical model; radiant heat flux distribution; radiation emission; radiation heat transfer; rapid thermal processing; reflector geometries; simulation; temperature uniformity; wafer surface temperature distribution; Analytical models; Furnaces; Geometrical optics; Heat transfer; Lamps; Numerical models; Rapid thermal processing; Semiconductor device modeling; Stimulated emission; Temperature;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.108214

Filename

108214