• DocumentCode
    1157726
  • Title

    Product-specific moisture levels: A conceptual framework

  • Author

    Blish, Richard C., II ; Sidharth

  • Author_Institution
    Adv. Micro Devices Inc., Sunnyvale, CA, USA
  • Volume
    3
  • Issue
    1
  • fYear
    2003
  • fDate
    3/1/2003 12:00:00 AM
  • Firstpage
    2
  • Lastpage
    7
  • Abstract
    An improved schedule to evaluate surface-mount technology popcorn jeopardy based on physics of moisture absorption is proposed. Key features are: 1) each lettered level implies a certain performance irrespective of package thickness (i.e., no penalty for thinner packages); 2) each successive level has stepped moisture concentration at the interior (i.e., clear stepped discrimination between levels); and 3) the time required for preconditioning is substantially reduced from current practice and an acceleration factor can be clearly computed.
  • Keywords
    integrated circuit packaging; integrated circuit reliability; moisture; surface mount technology; acceleration factor; moisture absorption; package thickness; popcorn jeopardy; preconditioning; product-specific moisture levels; stepped moisture concentration; surface-mount technology; Absorption; Acceleration; Building materials; Floors; Job shop scheduling; Moisture; Physics; Plastic packaging; Surface cracks; Surface-mount technology;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2003.808980
  • Filename
    1184102