DocumentCode
1157726
Title
Product-specific moisture levels: A conceptual framework
Author
Blish, Richard C., II ; Sidharth
Author_Institution
Adv. Micro Devices Inc., Sunnyvale, CA, USA
Volume
3
Issue
1
fYear
2003
fDate
3/1/2003 12:00:00 AM
Firstpage
2
Lastpage
7
Abstract
An improved schedule to evaluate surface-mount technology popcorn jeopardy based on physics of moisture absorption is proposed. Key features are: 1) each lettered level implies a certain performance irrespective of package thickness (i.e., no penalty for thinner packages); 2) each successive level has stepped moisture concentration at the interior (i.e., clear stepped discrimination between levels); and 3) the time required for preconditioning is substantially reduced from current practice and an acceleration factor can be clearly computed.
Keywords
integrated circuit packaging; integrated circuit reliability; moisture; surface mount technology; acceleration factor; moisture absorption; package thickness; popcorn jeopardy; preconditioning; product-specific moisture levels; stepped moisture concentration; surface-mount technology; Absorption; Acceleration; Building materials; Floors; Job shop scheduling; Moisture; Physics; Plastic packaging; Surface cracks; Surface-mount technology;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2003.808980
Filename
1184102
Link To Document