DocumentCode
1157816
Title
Microstrip calculations using an improved minimum-order boundary element method
Author
Deeley, E.M.
Author_Institution
Dept. of Electron. & Electr. Eng., King´´s Coll., London, UK
Volume
30
Issue
5
fYear
1994
fDate
9/1/1994 12:00:00 AM
Firstpage
3753
Lastpage
3756
Abstract
The minimum-order BE method, improved by correct modelling of 90° corners as described in an earlier paper, is used to compute the two-dimensional current distribution and a.c. resistance in two-layer conductors of interest to circuit designers. These include gold microstrip with a titanium adhesion layer, and copper p.c.b. interconnections with an overlay of solder, both over a ground plane
Keywords
adhesion; boundary-elements methods; conductors (electric); current distribution; microstrip lines; printed circuit accessories; printed circuits; AC resistance; Au; Cu; Ti; circuit designers; copper PCB interconnections; corner modelling; gold microstrip; ground plane; microstrip; minimum-order boundary element method; solder overlay; titanium adhesion layer; two-dimensional current distribution; two-layer conductors; Boundary element methods; Conductors; Current density; Current distribution; Distributed computing; Gold; Microstrip; Surface impedance; Surface resistance; Titanium;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/20.312757
Filename
312757
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