Title :
Microstrip calculations using an improved minimum-order boundary element method
Author_Institution :
Dept. of Electron. & Electr. Eng., King´´s Coll., London, UK
fDate :
9/1/1994 12:00:00 AM
Abstract :
The minimum-order BE method, improved by correct modelling of 90° corners as described in an earlier paper, is used to compute the two-dimensional current distribution and a.c. resistance in two-layer conductors of interest to circuit designers. These include gold microstrip with a titanium adhesion layer, and copper p.c.b. interconnections with an overlay of solder, both over a ground plane
Keywords :
adhesion; boundary-elements methods; conductors (electric); current distribution; microstrip lines; printed circuit accessories; printed circuits; AC resistance; Au; Cu; Ti; circuit designers; copper PCB interconnections; corner modelling; gold microstrip; ground plane; microstrip; minimum-order boundary element method; solder overlay; titanium adhesion layer; two-dimensional current distribution; two-layer conductors; Boundary element methods; Conductors; Current density; Current distribution; Distributed computing; Gold; Microstrip; Surface impedance; Surface resistance; Titanium;
Journal_Title :
Magnetics, IEEE Transactions on
