DocumentCode :
1158537
Title :
Test-Volume Reduction in Systems-on-a-Chip Using Heterogeneous and Multilevel Compression Techniques
Author :
Lingappan, Loganathan ; Ravi, Srivaths ; Raghunathan, Anand ; Jha, Niraj K. ; Chakradhar, Srimat T.
Author_Institution :
Dept. of Electr. Eng., Princeton Univ., NJ
Volume :
25
Issue :
10
fYear :
2006
Firstpage :
2193
Lastpage :
2206
Abstract :
In this paper, the authors present compression techniques for effectively reducing the test-data-volume requirements of modern systems-on-a-chip (SOC). Their techniques are based on the following observations: 1) Conventional test compression schemes, which are designed to satisfy various constraints including low hardware overheads and decompression times, cannot fully exploit compression opportunities present in test data and 2) due to the diversity of components used in SOCs (and consequently in their test strategies and test-data characteristics), a single compression strategy may not be best suited to handle them. The authors propose the use of multilevel and heterogeneous test compression schemes to address the above issues and demonstrate that they can provide significant reductions in the test volume above currently known state-of-the-art test compression techniques. An architecture that reuses infrastructure components already present in SOCs (programmable processors, on-chip communication architecture, memory, etc.) for an efficient implementation of their techniques is proposed. Finally, the authors suggest various architectural-customization techniques, such as partitioning of the decompression functionality between the hardware and software and the addition of custom instructions, to improve decompression times and reduce hardware overheads. Experiments with several designs, including an industrial media-processing SOC, demonstrate the efficacy of the proposed techniques in achieving test-data-volume reductions with low overheads
Keywords :
data compression; integrated circuit testing; logic design; system-on-chip; architectural-customization techniques; data compression; decompression times; hardware overheads; heterogeneous compression; multilevel compression; systems-on-a-chip; test compression; test-volume reduction; Automatic testing; Built-in self-test; Circuit testing; Computer architecture; Costs; Hardware; Integrated circuit testing; System testing; System-on-a-chip; Very large scale integration; Data compression; system-on-a-chip; test data; test volume;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2005.862735
Filename :
1677701
Link To Document :
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