Title :
Equivalent circuit model extraction of flip-chip ball interconnects based on direct probing techniques
Author :
Pfeiffer, Ullrich ; Welch, Brian
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
This letter describes a novel equivalent circuit model extraction approach for flip-chip ball interconnects based on a direct probing techniques. The derived model has been verified up to 40 GHz.
Keywords :
equivalent circuits; flip-chip devices; integrated circuit interconnections; millimetre wave integrated circuits; nondestructive testing; direct probing technique; equivalent circuit model extraction; flip-chip ball interconnects; millimeter-wave; Calibration; Data mining; Equivalent circuits; Frequency; Integrated circuit interconnections; Millimeter wave circuits; Millimeter wave technology; Packaging; Probes; Semiconductor device measurement; Flip-chip; millimeter-wave; nondestructive;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2005.855380
