DocumentCode
1159490
Title
Nanoscale Mechanical Properties of Intermetallics in Lead-Free Systems
Author
Braunovic, Milenko ; Gagnon, Daniel ; Rodrigue, Lisa
Author_Institution
MB Interface, Montreal, QC, Canada
Volume
32
Issue
2
fYear
2009
fDate
6/1/2009 12:00:00 AM
Firstpage
440
Lastpage
446
Abstract
Bimetallic couples formed between commercially available lead-free alloys and selected contact materials were subjected to diffusion annealing using thermal gradients. Following diffusion annealing and aging, the contact interfaces were subjected to a detailed metallographic, scanning electron microscope (SEM), and energy dispersive X-ray (EDX) analyses. In addition, electrical resistance was used for electrical characterization of the intermetallics formed at the contact interfaces, whereas the nanoindentation technique was used to determine the nanoscale mechanical properties. An attempt was made to correlate the observed nanoindentation data with the microstructures of the intermetallic phases formed and electrical resistivity.
Keywords
X-ray chemical analysis; alloys; electrical resistivity; mechanical properties; nanoindentation; scanning electron microscopy; solders; EDX; SEM; bimetallic couples; contact interfaces; contact materials; diffusion annealing; electrical resistance; energy dispersive X-ray analysis; intermetallic phases; intermetallics; lead-free alloys; nanoindentation technique; nanoscale mechanical properties; scanning electron microscope; thermal gradients; Electrical contact; intermetallic; lead free; nanoindenter; nanoscale;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2008.2008311
Filename
4783099
Link To Document