Title :
De-embedding procedure based on computed/measured data set for pcb structures characterization
Author :
Antonini, Giulio ; Scogna, Antonio Ciccomancini ; Orlandi, Antonio
Author_Institution :
Dept. of Electr. Eng., Univ. of L´´Aquila, Italy
Abstract :
This paper uses a de-embedding procedure, based on measured and numerically computed S-parameters, to obtain the characterization of portions of a structure difficult to obtain by direct measurements. The results are validated by measurements and independent calculations.
Keywords :
S-parameters; packaging; printed circuit testing; PCB; S-parameters; SMA connectors; de-embedding procedure; direct measurements; full wave modeling; structures characterization; Circuit simulation; Computational modeling; Connectors; Electromagnetic analysis; Electromagnetic measurements; Fixtures; Matrix converters; Numerical simulation; Packaging; Scattering parameters; 65; De-embedding; S-parameters; SMA connectors; full wave modeling;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2004.831849
