• DocumentCode
    1159522
  • Title

    De-embedding procedure based on computed/measured data set for pcb structures characterization

  • Author

    Antonini, Giulio ; Scogna, Antonio Ciccomancini ; Orlandi, Antonio

  • Author_Institution
    Dept. of Electr. Eng., Univ. of L´´Aquila, Italy
  • Volume
    27
  • Issue
    4
  • fYear
    2004
  • Firstpage
    597
  • Lastpage
    602
  • Abstract
    This paper uses a de-embedding procedure, based on measured and numerically computed S-parameters, to obtain the characterization of portions of a structure difficult to obtain by direct measurements. The results are validated by measurements and independent calculations.
  • Keywords
    S-parameters; packaging; printed circuit testing; PCB; S-parameters; SMA connectors; de-embedding procedure; direct measurements; full wave modeling; structures characterization; Circuit simulation; Computational modeling; Connectors; Electromagnetic analysis; Electromagnetic measurements; Fixtures; Matrix converters; Numerical simulation; Packaging; Scattering parameters; 65; De-embedding; S-parameters; SMA connectors; full wave modeling;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2004.831849
  • Filename
    1356002
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1159522