DocumentCode
1159538
Title
Statistical signal integrity analysis and diagnosis methodology for high-speed systems
Author
Matoglu, Erdem ; Pham, Nam ; De Araujo, Daniel N. ; Cases, Moises ; Swaminathan, Madhavan
Author_Institution
IBM, Austin, TX, USA
Volume
27
Issue
4
fYear
2004
Firstpage
611
Lastpage
629
Abstract
This paper discusses an efficient statistical analysis methodology for system-level signal integrity analysis. In the proposed method, statistical variations of the design and operational parameters are mapped to system performance through simulations based on orthogonal Taguchi arrays. Using the sensitivity functions derived from these simulations, statistical distributions of the performance measures are computed. The sensitivity functions and probability distributions of the design parameters are utilized as a diagnosis tool to estimate the design parameters of a system for a given measured performance. The statistical methodology is applied for design space exploration to improve system performance. For demonstrating the concept, a source synchronous memory bus and a peripheral input-output (I/O) bus have been analyzed under design and operational variations.
Keywords
Taguchi methods; design of experiments; high-speed integrated circuits; peripheral interfaces; sensitivity analysis; system buses; design parameters; design space exploration; diagnosis methodology; diagnosis tool; high-speed systems; orthogonal Taguchi arrays; peripheral input-output bus; probability distributions; sensitivity functions; source synchronous memory bus; source synchronous systems; statistical diagnosis; statistical signal integrity analysis; Computational modeling; Distributed computing; Probability distribution; Signal analysis; Signal design; Statistical analysis; Statistical distributions; System performance; Timing; Voltage; 65; Design of experiments; design space exploration; parametric yield; source synchronous systems; statistical diagnosis; statistical signal integrity analysis;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2004.831856
Filename
1356004
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