• DocumentCode
    1160687
  • Title

    A cool package for the 90s

  • Author

    Knudsen, Arne K. ; Garrou, Phillip E.

  • Author_Institution
    Electron. Ceramics & Adv. Mater. Group, Dow Chem. Co., Midland, MI, USA
  • Volume
    10
  • Issue
    5
  • fYear
    1994
  • Firstpage
    20
  • Lastpage
    25
  • Abstract
    Ceramic packaging offers a variety of properties that may be essential for the reliable operation of critical devices. Aluminum nitride, a relatively new and intriguing ceramic, may ultimately provide the best solution for a wide variety of electronic packaging tasks. Indeed, AlN-based packages have reached the marketplace. One obstacle remains, however: its relatively high cost.<>
  • Keywords
    aluminium compounds; ceramics; packaging; AlN; aluminum nitride; ceramic packaging; cost; critical devices; electronic packaging; Aluminum nitride; Aluminum oxide; Ceramics; Conducting materials; Costs; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Metallization; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/101.313460
  • Filename
    313460
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1160687