Multi-layer thin-film substrates for multi-chip packaging

Author

Chao, Clinton C. ; Scholz, Kenneth D. ; Leibovitz, Jacques ; Cobarruviaz, Maria ; Chang, Cheng C.

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

Volume

12

Issue

2

fYear

1989

fDate

6/1/1989 12:00:00 AM

Firstpage

180

Lastpage

184

Abstract

It is commonly recognized that multiple chip module (MCM) packaging offers great advantages in system performance by virtue of the elimination of an entire level of interconnection. Multilayer thin-film module technologies for high-performance multiple chip packaging were developed and integrated. The technologies, which feature four copper layers, polyimide dielectric, controlled-impedance transmission lines, and solder bump assembly, were demonstrated on a variety of vehicles including, recently, a 4-kbyte RAM module operating at above 100-MHz clock frequency. The generic MCM substrate technology is described. The process can be designed to be compatible with a number of substrate materials as required for specific applications

Keywords

VLSI; hybrid integrated circuits; integrated circuit technology; modules; packaging; polymer films; random-access storage; thin film circuits; 100 MHz; 4 kbyte; Cu layers; MCM; clock frequency; controlled-impedance transmission lines; generic MCM substrate technology; high-performance multiple chip packaging; level of interconnection elimination; multi-chip packaging; multilayer thin film module; multilayer thin film substrates; multiple chip module; polyimide dielectric; solder bump assembly; substrate materials; system performance; Assembly; Copper; Dielectric substrates; Dielectric thin films; Nonhomogeneous media; Packaging; Polyimides; System performance; Transistors; Transmission lines;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.31422

Filename

31422