DocumentCode :
1163102
Title :
Signal analysis methods to distinguish tracking process using time-frequency analysis
Author :
Jee, Seung-Wook ; Lee, Chun-Ha ; Lee, Kwang-Sik
Author_Institution :
Boo-sung Co. Daegu-si, Daegu
Volume :
16
Issue :
1
fYear :
2009
fDate :
2/1/2009 12:00:00 AM
Firstpage :
99
Lastpage :
106
Abstract :
This paper proposes a method to distinguish the tracking process only in terms of voltage waveforms. Tracking is simulated using the IEC (International Electrotechnical Commission) 60112 method. The tracking process is observed in 5 stages - static state, discharge inception, discharge in progress, carbon formation, and tracking breakdown. The measured voltage waveforms are analyzed by two signal processes. The two kinds of signal processing are: improved time-frequency and time-energy analysis. The tracking process can be distinguished by using the improved time-frequency analysis visually by stages. It can also be distinguished by using average and standard deviation for the results of the time-energy analysis. Particularly, probability distribution for the result of the time-energy analysis appears a regular pattern in tracking process by stages.
Keywords :
IEC standards; insulation testing; probability; signal processing; surface discharges; time-frequency analysis; voltage measurement; IEC 60112 method; International Electrotechnical Commission; carbon formation; discharge inception; discharge-in-progress; probability distribution; signal analysis method; signal processing method; static state; time-energy analysis; time-frequency analysis; tracking breakdown; tracking process; voltage waveform measurement; Bridge circuits; Electric breakdown; Electrodes; IEC standards; Insulation life; Probability distribution; Signal analysis; Signal processing; Time frequency analysis; Voltage measurement; Fourier transforms, time-frequency analysis, tracking.;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/TDEI.2009.4784556
Filename :
4784556
Link To Document :
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