• DocumentCode
    1163296
  • Title

    Identification of affecting factors of copper sulfide deposition on insulating paper in oil

  • Author

    Amimoto, T. ; Nagao, E. ; Tanimura, J. ; Toyama, S. ; Fujita, Y. ; Kawarai, H. ; Yamada, N.

  • Author_Institution
    Mitsubishi Electr. Corp., Ako
  • Volume
    16
  • Issue
    1
  • fYear
    2009
  • fDate
    2/1/2009 12:00:00 AM
  • Firstpage
    265
  • Lastpage
    272
  • Abstract
    Effects of oil brand, temperature and atmosphere conditions on copper sulfide deposition on insulating paper were investigated by thermal aging test. Copper sulfide deposition occurred in a certain oil brand and dibenzyl disulfide (DBDS) was found in the oil. There was an incubation period observed before copper sulfide deposition occurred. Copper sulfide deposition was accelerated by temperature. The deposition rate after the incubation period became twice when the heating temperature was increased by approximately 10degC. The incubation period and the deposition rate were the same at 140degC whether the thermal aging test was done in air or nitrogen atmosphere. On the other hand, the incubation period in air was shorter than that in nitrogen at 120degC. The deposition rate was not affected by atmosphere condition at 120degC. Intermediate substances due to copper dissolution into oil are introduced to explain the incubation period and the atmosphere dependence of incubation period observed at 120degC.
  • Keywords
    ageing; copper compounds; paper; transformer oil; copper sulfide deposition; deposition rate; dibenzyl disulfide; incubation period; oil insulating paper; temperature 120 degC; temperature 140 degC; thermal aging test; transformers; Acceleration; Aging; Atmosphere; Copper; Heating; Nitrogen; Oil insulation; Petroleum; Temperature; Testing; Copper, copper compounds, oil insulation, paper insulation, sulfur, sulfur compounds, transformers.;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2009.4784576
  • Filename
    4784576