DocumentCode
1164457
Title
Floating gate MOSFET with reduced programming voltage
Author
Johnson, L.G.
Volume
30
Issue
18
fYear
1994
fDate
9/1/1994 12:00:00 AM
Firstpage
1536
Lastpage
1537
Abstract
A floating gate MOSFET has been designed to minimise the tunnelling current density injected through the oxide between two polysilicon layers by using local field enhancement provided from a bump structure. Compared to the floating gate device introduced by Thomsen, the modified floating gate which is fabricated in the same standard 2 μm double-polysilicon CMOS technology, reduces the programming voltage by 2.4 V and the erasing voltage by 1.4 V
Keywords
insulated gate field effect transistors; semiconductor storage; tunnelling; 2 micron; Si-SiO2; bump structure; double-polysilicon CMOS technology; erasing voltage; floating gate MOSFET; injected tunnelling current density; local field enhancement; oxide; programming voltage;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19941027
Filename
317063
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