DocumentCode
1165041
Title
Simulation by ballistic deposition of local density variation and step coverage for via metallization
Author
Westra, K.L. ; Smy, T. ; Brett, Michael J.
Author_Institution
Dept. of Electr. Eng., Alberta Univ., Edmonton, Alta., Canada
Volume
10
Issue
5
fYear
1989
fDate
5/1/1989 12:00:00 AM
Firstpage
198
Lastpage
199
Abstract
The simulation is presented of ballistic deposition of sputtered metal deposited over a via. The step coverage of the film is determined and surface profiles provided at different film thicknesses. The use of a ballistic deposition technique provides additional information unattainable through the use of conventional film deposition simulations. A density profile of the film is produced and the columnar microstructure analyzed.<>
Keywords
metallic thin films; metallisation; sputtered coatings; surface topography; ballistic deposition; columnar microstructure; film density profile; film thicknesses; local density variation; simulation; sputtered metal; step coverage; surface profiles; via metallization; Atomic layer deposition; Atomic measurements; Metallization; Microstructure; Semiconductor process modeling; Shadow mapping; Sputtering; Substrates; Surface topography; Very large scale integration;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.31719
Filename
31719
Link To Document