DocumentCode :
1165132
Title :
High-performance self-aligned (Al,Ga)As/(In,Ga)As pseudomorphic HIGFETs
Author :
Abrokwah, J.K. ; Stephens, J.M.
Author_Institution :
McDonnell Douglas Aeronaut. Co., Huntington Beach, CA, USA
Volume :
10
Issue :
5
fYear :
1989
fDate :
5/1/1989 12:00:00 AM
Firstpage :
225
Lastpage :
226
Abstract :
Transconductance as high as 676 mS/mm at 300 K was observed to 0.7*10- mu m/sup 2/ n-channel devices (HIGFETs) made on epilayers with Al/sub 0.3/Ga/sub 0.7/As insulator thickness of 200 AA and In/sub 0.15/Ga/sub 0.85/As channel thickness of 150 AA. An FET K value (K=W/sub g/U epsilon /2aL/sub g/) as large as 10.6 mA/V/sup 2/ was also measured from another device with transconductance of 411 mS/mm. The high K values are achieved under normal FET operation without hole-injection or drain-avalanche breakdown effects. These results demonstrate the promise of pseudomorphic (Al,Ga)As/(In,Ga)As HIGFETs for high-performance circuit applications.<>
Keywords :
III-V semiconductors; aluminium compounds; gallium arsenide; indium compounds; insulated gate field effect transistors; 411 mS; 676 mS; Al/sub 0.3/Ga/sub 0.7/As-In/sub 0.15/Ga/sub 0.85/As; K-value; drain current; epilayers; heterostructure IGFET; high-performance circuit applications; n-channel devices; normal FET operation; pseudomorphic HIGFET; transconductance; Circuits; FETs; Fabrication; Gallium arsenide; Insulation; Molecular beam epitaxial growth; Rapid thermal annealing; Threshold voltage; Transconductance; Very large scale integration;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.31728
Filename :
31728
Link To Document :
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