• DocumentCode
    1165820
  • Title

    The implementation of physical boundary conditions in the Monte Carlo simulation of electron devices

  • Author

    Woolard, D.L. ; Tian, H. ; Littlejohn, M.A. ; Kim, K.W.

  • Author_Institution
    Army Res Lab., Fort Monmouth, NJ, USA
  • Volume
    13
  • Issue
    10
  • fYear
    1994
  • fDate
    10/1/1994 12:00:00 AM
  • Firstpage
    1241
  • Lastpage
    1246
  • Abstract
    This paper investigates the problem of specifying and implementing physical boundary conditions for the Monte Carlo (MC) simulation of electron dynamics in semiconductor devices. The goal of this work is to establish an accurate and efficient ohmic boundary condition scheme for use in characterizing realistic device structures. In this work, three distinct physical models for specifying the boundary electrons at the ideal ohmic contacts of an N+-N-N+ GaAs Ballistic diode structure are investigated. This study demonstrates that a displaced Maxwellian scheme, which allows for an electron ensemble with momentum space displacement and random spread, presents definite computational advantages when one is interested in resolving asymmetries in the electron distribution function throughout the semiconductor device structure
  • Keywords
    III-V semiconductors; Monte Carlo methods; digital simulation; electronic engineering computing; gallium arsenide; ohmic contacts; semiconductor device models; semiconductor diodes; Monte Carlo simulation; N+-N-N+ GaAs ballistic diode structure; displaced Maxwellian scheme; electron distribution function; electron dynamics; ideal ohmic contacts; momentum space displacement; ohmic boundary condition; physical boundary conditions; physical models; random spread; semiconductor devices; Boundary conditions; Distributed computing; Distribution functions; Electron devices; Gallium arsenide; Monte Carlo methods; Ohmic contacts; Predictive models; Semiconductor devices; Semiconductor diodes;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.317467
  • Filename
    317467