Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications

Author

Park, Jongbae ; Lu, Albert Chee W ; Chua, Kai M. ; Wai, Lai L. ; Lee, Junho ; Kim, Joungho

Author_Institution

Dept. of Electr. Eng., Korea Adv. Energy Res. Inst., Daejeon

Volume

16

Issue

9

fYear

2006

Firstpage

481

Lastpage

483

Abstract

We propose a novel electromagnetic bandgap (EBG) structure with a significantly extended noise isolation bandwidth, called a double-stacked EBG (DS-EBG) structure, fabricated on a low-temperature co-fired ceramic (LTCC) multilayer substrate. The DS-EBG structure was devised for wideband suppression of simultaneous switching noise (SSN) coupling in system-in-package (SiP) applications. Our design approach was enabled by combining two EBG layers embedded between the power and ground planes. The two EBG layers had different bandgaps from using different cell sizes. Enhanced wideband suppression of the SSN coupling was validated using a 11.4-GHz noise stop bandwidth with 30-dB isolation in time and frequency domain measurements up to 20GHz

Keywords

ceramics; integrated circuit noise; interference suppression; multilayers; photonic band gap; substrates; system-in-package; 11.4 GHz; LTCC-based SiP applications; double-stacked electromagnetic bandgap structure; frequency domain measurements; ground planes; low-temperature co-fired ceramic multilayer substrate; mixed-signal system; noise isolation bandwidth; noise stop bandwidth; power planes; simultaneous switching noise; system-in-package; time domain measurements; wideband suppression; Bandwidth; Ceramics; Electromagnetic interference; Frequency domain analysis; Frequency measurement; Metamaterials; Nonhomogeneous media; Periodic structures; Photonic band gap; Wideband; Double-stacked EBG; SSN coupling; electromagnetic bandgap (EBG); low-temperature co-fired ceramic (LTCC); mixed-signal system; simultaneous switching noise (SSN); system-in-package (SiP);

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2006.880719

Filename

1683799