DocumentCode :
1167109
Title :
Influence of Concurrent Electrothermal and Avalanche Effects on the Safe Operating Area of Multifinger Bipolar Transistors
Author :
La Spina, Luigi ; D´Alessandro, Vincenzo ; Russo, Salvatore ; Rinaldi, Niccolò ; Nanver, Lis K.
Author_Institution :
Dept. of Electron. & Telecommun. Eng., Univ. of Naples Federico II, Naples
Volume :
56
Issue :
3
fYear :
2009
fDate :
3/1/2009 12:00:00 AM
Firstpage :
483
Lastpage :
491
Abstract :
The impact of the concurrent action of electrothermal and avalanche effects on the reduction of the safe operating area is experimentally investigated for a wide number of single-, two-, and three-finger bipolar transistors fabricated in SiGe, GaAs, and silicon-on-glass technologies. The results of the analysis are substantiated by a SPICE-like simulation tool that allows the monitoring of the temperatures of the individual fingers and provides an in-depth understanding of the individual influence of the positive feedback mechanisms. Design strategies for minimizing the effects on device operation, like the implementation of ballasting resistors and emitter segmentation, are also analyzed.
Keywords :
Ge-Si alloys; III-V semiconductors; avalanche breakdown; bipolar transistors; gallium arsenide; semiconductor device reliability; GaAs; SiGe; avalanche effect; ballasting resistor; electrothermal effect; emitter segmentation; multifinger bipolar transistors; positive feedback mechanism; safe operating area; silicon-on-glass technology; Analytical models; Bipolar transistors; Electrothermal effects; Fingers; Gallium arsenide; Germanium silicon alloys; Monitoring; Silicon germanium; Temperature measurement; Temperature sensors; Avalanche effect; ballasting resistors; bipolar junction transistor (BJT); breakdown voltage; electrothermal effects; emitter ballasting; emitter segmentation; heterojunction bipolar transistor (HBT); impact ionization (II); multifinger transistor; safe operating area (SOA); self-heating; silicon-on-glass (SOG); thermal coupling; thermal instability; thermal resistance;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2008.2011574
Filename :
4785491
Link To Document :
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