DocumentCode :
1167762
Title :
Invitation from the ISSCC 2007 Technical Program Chair
Author :
Van der Spiegel, Jan
Author_Institution :
Technical Program Chair, ISSCC 2007 jan@seas.upenn.edu
Volume :
12
Issue :
1
fYear :
2007
Firstpage :
75
Lastpage :
75
Abstract :
The conference theme is ´The 4 Dimensions of IC Innovation,´ in recognition of the emerging synergisms between the various aspects of integrated circuit realization. A common theme among many of the papers is how to control power consumption in deep-submicron technologies while pushing for higher performance and functionality. This requires careful optimization among the four dimensions of IC design (technology, devices, circuits, and architecture).
fLanguage :
English
Journal_Title :
Solid-State Circuits Society Newsletter, IEEE
Publisher :
ieee
ISSN :
1098-4232
Type :
jour
DOI :
10.1109/N-SSC.2007.4785556
Filename :
4785556
Link To Document :
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