• DocumentCode
    1168834
  • Title

    Diminishment of Spark Damages in MGCs by Using Diamond Thin Films

  • Author

    Hou, Zhongyu ; Chen, Changxin ; Wang, Yun ; Wei, Xing ; Bian, Jianjiang ; Xu, Dong ; Cai, Bingchu

  • Author_Institution
    Nat. Key Lab. of Nano/Micro Fabrication Technol., Shanghai Jiao Tong Univ.
  • Volume
    53
  • Issue
    4
  • fYear
    2006
  • Firstpage
    2288
  • Lastpage
    2295
  • Abstract
    A simulation method on estimation of the anode material damage caused by spark discharges is developed. These discharges are well known to cause permanent failures of microgap gas chambers (MGCs). Systematic analysis and optimization studies have been performed through finite element methods (FEM) simulations using Ansys6.1. The results have evidently shown that, owing to their super high heat conductivity, introduction of diamond thin films (DTFs) as an insulating layer can enormously diminish or even avoid melting or vaporizing of the anodes via spark discharges. Furthermore, topological optimization and anode material selection studies using the FEM simulation technique have been carried out to enhance MGC operational stability. Samples based on the simulation results have been successfully fabricated and tested
  • Keywords
    finite element analysis; heat conduction; insulating thin films; optimisation; spark chambers; spark gaps; sparks; thermal conductivity; Ansys6.1; FEM; MGC operational stability; MGCs; anode material damage; anode material selection studies; finite element methods; insulating layer; microgap gas chambers; spark damages; spark discharges; super high heat conductivity; topological optimization; Analytical models; Anodes; Conducting materials; Conductivity; Finite element methods; Insulation; Optimization methods; Performance analysis; Sparks; Transistors; Diamond thin films; finite element methods; microgap gas chambers; spark damage;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2006.878129
  • Filename
    1684103