Fully SMT-compatible optical-I/O package with microlens array interface

Author

Ishii, Yuzo ; Tanaka, Nobuyuki ; Sakamoto, Takeshi ; Takahara, Hideyuki

Author_Institution

NTT Microsystem Integration Labs., Kanagawa, Japan

Volume

21

Issue

1

fYear

2003

fDate

1/1/2003 12:00:00 AM

Firstpage

275

Lastpage

280

Abstract

A new optoelectronic package for interchip optical interconnections is presented. To make cost-effective IC-packaging and printed circuit board (PCB) assembly, we strongly emphasize the need for full compatibility with surface-mount technology (SMT). Based on the "OptoBump" interface, which couples the package and PCB by means of an array of wide, collimated beams, we developed two prototype packages: a transmitter package that contains a vertical-cavity surface-emitting laser (VCSEL) array and a driver-IC, and a receiver package that contains a photodiode (PD) array and a receiver-IC. A microlens array is integrated with each package to counteract misalignments that occur in the SMT process. All three output signals, which are E/O (O/E)-converted in the each package, exhibit clear eye diagrams at 1.25 Gb/s after the packages are surface-mounted on a PCB. The influence of polymer encapsulation on a VCSEL and an evaluation of the optical interface provided by the three optical beams on a 500-μm center-to-center spacing are also discussed.

Keywords

driver circuits; integrated circuit packaging; integrated optoelectronics; microlenses; optical arrays; optical interconnections; optical receivers; optical transmitters; printed circuits; semiconductor laser arrays; surface emitting lasers; surface mount technology; 1.25 Gbit/s; 500 micron; SMT-compatible optical-I/O package; VCSEL array; center-to-center spacing; clear eye diagrams; collimated beams; cost-effective IC-packaging; driver-IC; interchip optical interconnections; microlens array; microlens array interface; optical beams; optical interconnections; optical interface; optoelectronic package; output signals; polymer encapsulation; printed circuit board assembly; receiver package; receiver-IC; surface-mount technology; surface-mounted; transmitter package; vertical-cavity surface-emitting laser; Lenses; Microoptics; Optical arrays; Optical beams; Optical interconnections; Optical receivers; Optical transmitters; Packaging; Surface-mount technology; Vertical cavity surface emitting lasers;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/JLT.2003.808611

Filename

1190175