DocumentCode :
1169515
Title :
Noise and Cooling in Electronics Packages
Author :
Lyon, Richard H. ; Bergles, Arthur E.
Volume :
29
Issue :
3
fYear :
2006
Firstpage :
535
Lastpage :
542
Abstract :
The noise produced by cooling air passing through electronics packages arises from two sources. One source is the noise of the air-moving fan of either an axial or centrifugal type. This noise may have both tonal and random components and is strongly dependent on the way that the fan is placed in the unit and on where its operation is on the fan´s operating curve. Often, fans are the dominant noise sources. The flow of air produces random noise due to the turbulence generated throughout the unit. Because the turbulent airflow is also responsible for heat transfer between the components and the air stream, we can regard this part of the noise as the irreducible noise due to cooling. If fan noise were eliminated, this part of the noise would remain. There is a relation, therefore, between the irreducible noise and the cooling of the unit. But the fan noise must also be considered. The relation between total airflow related noise and cooling requirements is developed in this paper for the irreducible noise
Keywords :
cooling; electronics packaging; fans; random noise; turbulence; airflow related noise; cooling air; cooling requirements; electronics packages; fan noise; heat transfer; irreducible noise; noise sources; random noise; turbulent airflow; Acoustic noise; Drag; Ducts; Electronics cooling; Electronics packaging; Heat transfer; Noise generators; Noise reduction; Temperature; Thermal conductivity; Circuit board cooling; cooling and noise; electronic packages; fan and flow noise;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2006.880512
Filename :
1684176
Link To Document :
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