Layer Structure and Thickness Effects on Electroplated AuSn Solder Bump Composition

Author

Bonafede, Salvatore ; Huffman, Alan ; Palmer, W. Devereux

Author_Institution

Nextreme Thermal Solutions, Research Traingle Park, NC

Volume

29

Issue

3

fYear

2006

Firstpage

604

Lastpage

609

Abstract

The eutectic gold-tin (AuSn) solder composition is receiving increased attention for packaging applications. In addition to the environmental benefits of removing lead compounds from electronic manufacturing, gold-tin eutectic also exhibits desirable mechanical properties such as high strength and low thermal fatigue. However, some methods of deposition for this solder require complicated processes or limit the minimum bump size. This paper explores the formation of AuSn eutectic solder bumps using sequential electrodeposition of Au and Sn to determine the effect of layer thickness and sequence on the composition and structure of the resulting solder bump

Keywords

electroplating; eutectic alloys; gold alloys; integrated circuit interconnections; solders; tin alloys; AuSn; electroplating; eutectic gold-tin solder composition; eutectic solder bumps; layer structure; sequential electrodeposition; thickness effects; Chemistry; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Fatigue; Gold; Lead; Mechanical factors; Oxidation; Temperature; Tin; Electrochemical processes; fabrication; gold alloys; lead-free solder; tin alloys;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2006.880506

Filename

1684184