Placement and Routing for 3-D System-On-Package Designs

Three-dimensional (3-D) packaging via system-on-package (SOP) is a viable alternative to system-on-chip (SOC) to meet the rigorous requirements of today´s mixed signal system integration. In this article, we present the first physical design algorithms for thermal and power supply noise-aware 3-D placement and crosstalk-aware 3-D global routing. Existing approaches consider the thermal distribution, power supply noise, and crosstalk issues as an afterthought, which may require an expensive cooling scheme, more decoupling capacitors (=decap), and additional routing layers. Our goal is to overcome this problem with our thermal/decap/crosstalk-aware 3-D layout automation tools. The traditional design objectives such as performance, area, wirelength, and via are considered simultaneously to ensure high quality results. The related experimental results demonstrate the effectiveness of our approaches