DocumentCode
1169715
Title
Impact on Polarization Extinction Ratio by Stresses in a Polarization Maintaining Fiber Soldered Into a Ferrule
Author
Li, Jin ; Labudovic, Marko ; Young, Joseph R.
Author_Institution
Photonics Center, Univ. of Massachusetts, Lowell, MA
Volume
29
Issue
3
fYear
2006
Firstpage
696
Lastpage
701
Abstract
The thermally induced stresses in an optical fiber soldered into a ferrule can affect the bi-refringence of polarization maintaining (PM) fibers, which results in a change to the polarization extinction ratio (PER) of the linear polarized light coupled into the slow axis of PM fibers. Stresses are induced by differences in thermal expansion between the fiber, the solder and the ferrule during the solder solidification process. In this work, the thermally induced stresses in the fiber, the solder, and the ferrule are modeled numerically, and the changes in PER of different fiber-solder-ferrule (FSF) assemblies are studied experimentally. The smallest degradation in PER is observed in FSF assemblies with a Kovar ferrule and glass solder. The results agree with the lowest thermally induced stresses predicted by the three-dimensional finite element analysis (3-D FEA). This demonstrated that the degradation in PER can be decreased by reducing thermally induced stresses through the proper selection of materials for the solder and ferrule for polarization sensitive applications, such as semiconductor pump lasers
Keywords
birefringence; finite element analysis; optical fibre fabrication; polarisation; soldering; thermal stresses; 3D finite element analysis; Kovar ferrule; birefringence; fiber solder ferrule assemblies; glass solder; optical fiber soldering; polarization extinction ratio; polarization maintaining fiber; polarization sensitive applications; thermally induced stresses; Assembly; Extinction ratio; Numerical models; Optical coupling; Optical fiber polarization; Optical fibers; State feedback; Thermal degradation; Thermal expansion; Thermal stresses; Fiber-solder-ferrule (FSF) assembly; finite element (FE) methods; polarization extinction ratio (PER); semiconductor lasers; thermally induced stresses;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2006.881761
Filename
1684194
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