DocumentCode
1170267
Title
Where CMOS is Going: Trendy Hype vs. Real Technology
Author
Chen, Tze-Chiang T C
Author_Institution
IBM Fellow, VP of Science and Technology, T.J. Watson Research Center, IBM Research Division
Volume
11
Issue
5
fYear
2006
Firstpage
5
Lastpage
9
Abstract
Two important challenges facing Moore´s Law and continued CMOS scaling are growing standby power dissipation and the increasing variability in device characteristics. Cooperative circuit/technology co-design and architectures developed in conjunction with new materials and device structures will provide a comprehensive solution to these challenges
Keywords
CMOS integrated circuits; Cooling; Data mining; Logic gates; Performance evaluation; Probability density function; Random access memory;
fLanguage
English
Journal_Title
Solid-State Circuits Society Newsletter, IEEE
Publisher
ieee
ISSN
1098-4232
Type
jour
DOI
10.1109/N-SSC.2006.4785853
Filename
4785853
Link To Document