• DocumentCode
    1171961
  • Title

    Thin oxide charging current during plasma etching of aluminum

  • Author

    Shin, H. ; King, C.-C. ; Horiuchi, T. ; Hu, Chenming

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • Volume
    12
  • Issue
    8
  • fYear
    1991
  • Firstpage
    404
  • Lastpage
    406
  • Abstract
    CV measurement is shown to be a more sensitive technique for characterizing plasma-etching induced damage than oxide breakdown. Plasma etching of Al is shown to produce severe distortions in the oxide CV characteristics, from which one can easily deduce the plasma charging current over many orders of magnitude. A clear radial variation of stressing is found and the charging current increases in proportion to the Al peripheral length rather than the area. Using the measured 10-pA/ mu m of the charging current, one should be able to predict the impact of this etch process on oxide integrity and interface stability for a given antenna geometry.<>
  • Keywords
    MOS integrated circuits; VLSI; aluminium; capacitance measurement; metallisation; sputter etching; Al peripheral length; Al plasma etching; CV measurement; antenna geometry; characterizing plasma-etching induced damage; gate oxides damage; interface stability; orders of magnitude; oxide integrity; plasma etching; radial variation of stressing; sensitive technique; thin oxide charging current; Aluminum; Antenna measurements; Current measurement; Distortion measurement; Electric breakdown; Etching; Plasma applications; Plasma measurements; Plasma properties; Stability;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.119146
  • Filename
    119146