Title :
Thin oxide charging current during plasma etching of aluminum
Author :
Shin, H. ; King, C.-C. ; Horiuchi, T. ; Hu, Chenming
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Abstract :
CV measurement is shown to be a more sensitive technique for characterizing plasma-etching induced damage than oxide breakdown. Plasma etching of Al is shown to produce severe distortions in the oxide CV characteristics, from which one can easily deduce the plasma charging current over many orders of magnitude. A clear radial variation of stressing is found and the charging current increases in proportion to the Al peripheral length rather than the area. Using the measured 10-pA/ mu m of the charging current, one should be able to predict the impact of this etch process on oxide integrity and interface stability for a given antenna geometry.<>
Keywords :
MOS integrated circuits; VLSI; aluminium; capacitance measurement; metallisation; sputter etching; Al peripheral length; Al plasma etching; CV measurement; antenna geometry; characterizing plasma-etching induced damage; gate oxides damage; interface stability; orders of magnitude; oxide integrity; plasma etching; radial variation of stressing; sensitive technique; thin oxide charging current; Aluminum; Antenna measurements; Current measurement; Distortion measurement; Electric breakdown; Etching; Plasma applications; Plasma measurements; Plasma properties; Stability;
Journal_Title :
Electron Device Letters, IEEE