Title :
A comparison of gold and superconductors used as air-bridge and microstrip interconnects for high-speed VLSI
Author :
Dykstra, Jeff ; Brown, Richard B.
Author_Institution :
Dept. of Electr. Eng. & Comput Sci., Michigan Univ., Ann Arbor, MI, USA
fDate :
6/1/1989 12:00:00 AM
Abstract :
Surface and air-bridge interconnects formed of gold and superconducting material are compared using SPICE simulations. For realistic gates, superconducting connections are only marginally faster than gold interconnects, while signal ringing is worse. (Finer geometries could increase the speed of superconducting lines). In either material, air bridges are faster than conventional microstrips
Keywords :
VLSI; digital simulation; gold; integrated circuit technology; metallisation; superconducting junction devices; Au; SPICE; air-bridge; high-speed VLSI; microstrip interconnects; signal ringing; superconducting lines; superconducting material; Capacitance; Circuit simulation; Delay; Gold; High temperature superconductors; Integrated circuit interconnections; Microstrip; Superconducting filaments and wires; Superconducting materials; Superconductivity;
Journal_Title :
Solid-State Circuits, IEEE Journal of
