• DocumentCode
    1172437
  • Title

    Preparation of loading information for reliability simulation

  • Author

    Lopez, Leoncio D. ; Nathan, Swami ; Santos, Sarah

  • Author_Institution
    Phys. Sci. Center, Sun Microsystems Inc., San Diego, CA, USA
  • Volume
    27
  • Issue
    4
  • fYear
    2004
  • Firstpage
    732
  • Lastpage
    735
  • Abstract
    Many decisions regarding the design with a system using sockets are made using a point estimate (often from a standard or accepted practice) of the compressive load. The components of a CLGA assembly were analyzed using Monte Carlo simulation methods to determine the distribution of the compressive loads that are applied to the component socket. The components of the assembly that impact the resulting load were identified and their individual distributions defined. The relationship between the height of the components and the compression provided by the springs was determined and used to estimate a load distribution. The load distribution thus estimated can be used as an input to further virtual qualification efforts. For example, the estimated load distribution from this analysis was used with other manufacturing parameters and FEA models to estimate the IC socket contact compression. The results showed that the minimum compression required for a good electrical contact was achieved over 99.9% of the time. Therefore, information that is obtained from virtual qualification was shown to be of great value in the determination of proper test conditions and design decision making.
  • Keywords
    Monte Carlo methods; electric connectors; failure analysis; life testing; reliability; Monte Carlo simulation; ceramic land grid array microprocessor; component socket; compressive loads; failure assessment; failure sites; information loading; life consumption monitoring strategy; life-cycle load; manufacturing variability; reliability risks; reliability simulation; virtual qualification; Assembly; Contacts; High performance computing; Integrated circuit interconnections; Life testing; Qualifications; Risk management; Sockets; Stress; System testing; 65; Life-cycle load; VQ; virtual qualification;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.840092
  • Filename
    1362809