DocumentCode
1173504
Title
Conductive adhesives for electronics packaging [Book Review]
Author
Schoch, K.F.
Volume
19
Issue
2
fYear
2003
Firstpage
46
Lastpage
46
Keywords
Book reviews; Conducting materials; Conductive adhesives; Dielectrics; Electronics packaging; Failure analysis; Mechanical factors; Microelectronics; Polymer films; Stability;
fLanguage
English
Journal_Title
Electrical Insulation Magazine, IEEE
Publisher
ieee
ISSN
0883-7554
Type
jour
DOI
10.1109/MEI.2003.1192038
Filename
1192038
Link To Document