DocumentCode :
1173504
Title :
Conductive adhesives for electronics packaging [Book Review]
Author :
Schoch, K.F.
Volume :
19
Issue :
2
fYear :
2003
Firstpage :
46
Lastpage :
46
Keywords :
Book reviews; Conducting materials; Conductive adhesives; Dielectrics; Electronics packaging; Failure analysis; Mechanical factors; Microelectronics; Polymer films; Stability;
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2003.1192038
Filename :
1192038
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1173504
