• DocumentCode
    1173561
  • Title

    PMOS transistors in LPCVD polycrystalline silicon-germanium films

  • Author

    King, Tsu-Jae ; Saraswat, Krishna C. ; Pfiester, James R.

  • Author_Institution
    Center for Integrated Syst., Stanford Univ., CA, USA
  • Volume
    12
  • Issue
    11
  • fYear
    1991
  • Firstpage
    584
  • Lastpage
    586
  • Abstract
    P-channel MOS thin-film transistors (TFTs) have been fabricated in low-pressure chemical vapor deposition (LPCVD) polycrystalline silicon-germanium (poly-SiGe) films using either a low-temperature (>
  • Keywords
    CVD coatings; Ge-Si alloys; hydrogen; insulated gate field effect transistors; thin film transistors; 600 C; 950 C; LPCVD; MOS thin-film transistors; PMOS transistors; active channel region; anneal temperatures; anneal times; electrically active traps reduction; high temperature process; hydrogenation; low temperature process; low-pressure chemical vapor deposition; poly-SiGe; polycrystalline SiGe:H; transistor characteristics; Annealing; Chemical vapor deposition; Electrodes; Germanium silicon alloys; Implants; MOSFETs; Semiconductor films; Silicon germanium; Temperature; Thin film transistors;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.119205
  • Filename
    119205