• DocumentCode
    1173767
  • Title

    Effects of poly depletion on the estimate of thin dielectric lifetime

  • Author

    Wang, Shoue Jen ; Chen, Ih-Chin ; Tigelaar, Howard L.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    12
  • Issue
    11
  • fYear
    1991
  • Firstpage
    617
  • Lastpage
    619
  • Abstract
    Poly-gate depletion during the accelerated time-dependent breakdown (TDDB) test of single-doping-type capacitors (both electrodes of the doping type) results in an overestimate of dielectric lifetime at operation voltage. Simple high-field data extrapolation fails to take into account the voltage-dependent poly band bending. A three-orders-of-magnitude overestimate of lifetime at 5 V for 68-AA oxide equivalent poly/poly capacitors was found. After correcting for the poly depletion effects, the slope of the TDDB projection line decreases by 18%. The effects can be minimized by performing TDDB testing below the top poly inversion voltage. Fermi-Dirac statistics quantitatively explained the phenomenon. Calculated maximum allowable TDDB voltages for different gate doping and oxide thickness are presented as guidelines for test design.<>
  • Keywords
    capacitors; electric breakdown of solids; life testing; silicon; silicon compounds; 5 V; 68 A; Fermi-Dirac statistics; TDDB testing; accelerated time dependent breakdown test; estimate of thin dielectric lifetime; gate doping; guidelines for test design; high-field data extrapolation; lifetime overestimate; operation voltage; overestimate of dielectric lifetime; oxide thickness; polycrystalline Si depletion effects; polysilicon depletion effects; single-doping-type capacitors; three-orders-of-magnitude overestimate of lifetime; voltage-dependent poly band bending; Breakdown voltage; Capacitors; Dielectric breakdown; Doping; Electrodes; Extrapolation; Life estimation; Life testing; Performance evaluation; Statistics;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.119216
  • Filename
    119216