DocumentCode :
1173849
Title :
Ultrafast operation of V/sub th/-adjusted p/sup +/-n/sup +/ double-gate SOI MOSFET´s
Author :
Tanaka, T. ; Suzuki, K. ; Horie, H. ; Sugii, T.
Author_Institution :
Fujitsu Labs. Ltd., Atsugi, Japan
Volume :
15
Issue :
10
fYear :
1994
Firstpage :
386
Lastpage :
388
Abstract :
To optimize the V/sub th/ of double-gate SOI MOSFET´s, we fabricated devices with p/sup +/ poly-Si for the front-gate electrode and n/sup +/ poly-Si for the back-gate electrode on 40-nm-thick direct-bonded SOI wafers. We obtained an experimental V/sub th/ of 0.17 V for nMOS and -0.24 V for pMOS devices. These double-gate devices have good short-channel characteristics, low parasitic resistances, and large drive currents. For gates 0.19 μm long, front-gate oxides 8.2 nm thick, and back-gate oxides 9.9 nm thick, we obtained ring oscillator delay times of 43 ps at 1 V and 27 ps at 2 V. To our knowledge, these values are the fastest reported for this gate length with suppressed short-channel effects.
Keywords :
elemental semiconductors; insulated gate field effect transistors; semiconductor-insulator boundaries; silicon; -0.24 V; 0.17 V; 0.19 micron; 27 to 43 ps; CMOS device; SOI MOSFET; Si; back-gate electrode; direct-bonded SOI wafers; double-gate devices; front-gate electrode; n/sup +/ poly-Si; nMOS devices; p/sup +/ poly-Si; p/sup +/-n/sup +/ double-gate structure; pMOS devices; polysilicon; short-channel characteristics; ultrafast operation; Delay effects; Electrodes; FETs; MOS devices; MOSFET circuits; Ring oscillators; Silicon; Thickness control; Threshold voltage; Wafer bonding;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.320976
Filename :
320976
Link To Document :
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