DocumentCode
1173901
Title
Thermally and electrically isolated single crystal silicon structures in CMOS technology
Author
Reay, Richard J. ; Klaassen, Erno H. ; Kovacs, Gregory T A
Author_Institution
Dept. of Electr. Eng., Stanford Univ., CA, USA
Volume
15
Issue
10
fYear
1994
Firstpage
399
Lastpage
401
Abstract
Thermally and electrically isolated single crystal silicon structures have been fabricated using a post-processing anisotropic tetramethyl ammonium hydroxide (TMAH) electrochemical etch. The process was carried out on CMOS circuits fabricated by a commercial foundry. Since the etch consists of a single micromachining step performed on packaged and bonded dice, this technique has the potential for cost-effective prototyping and production of integrated sensors and circuits.<>
Keywords
CMOS integrated circuits; elemental semiconductors; etching; integrated circuit technology; silicon; CMOS technology; Si; TMAH; electrical isolation; electrochemical etching; micromachining step; post-processing anisotropic etch; single crystal Si structures; tetramethyl ammonium hydroxide; thermal isolation; Anisotropic magnetoresistance; Bonding; CMOS process; Circuits; Etching; Foundries; Micromachining; Packaging; Prototypes; Silicon;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.320981
Filename
320981
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