• DocumentCode
    1173901
  • Title

    Thermally and electrically isolated single crystal silicon structures in CMOS technology

  • Author

    Reay, Richard J. ; Klaassen, Erno H. ; Kovacs, Gregory T A

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., CA, USA
  • Volume
    15
  • Issue
    10
  • fYear
    1994
  • Firstpage
    399
  • Lastpage
    401
  • Abstract
    Thermally and electrically isolated single crystal silicon structures have been fabricated using a post-processing anisotropic tetramethyl ammonium hydroxide (TMAH) electrochemical etch. The process was carried out on CMOS circuits fabricated by a commercial foundry. Since the etch consists of a single micromachining step performed on packaged and bonded dice, this technique has the potential for cost-effective prototyping and production of integrated sensors and circuits.<>
  • Keywords
    CMOS integrated circuits; elemental semiconductors; etching; integrated circuit technology; silicon; CMOS technology; Si; TMAH; electrical isolation; electrochemical etching; micromachining step; post-processing anisotropic etch; single crystal Si structures; tetramethyl ammonium hydroxide; thermal isolation; Anisotropic magnetoresistance; Bonding; CMOS process; Circuits; Etching; Foundries; Micromachining; Packaging; Prototypes; Silicon;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.320981
  • Filename
    320981