DocumentCode :
1173984
Title :
Thermal oxidation of 6H-silicon carbide at enhanced growth rates
Author :
Alok, Dev ; Baliga, B.Jayant ; McLarty, Peter K.
Author_Institution :
Power Semicond. Res. Centre, North Carolina State Univ., Raleigh, NC, USA
Volume :
15
Issue :
10
fYear :
1994
Firstpage :
424
Lastpage :
426
Abstract :
A new oxidation scheme with enhanced growth rate for silicon carbide is reported in this paper. It is based upon the formation of a thick amorphous layer created using high dose ion implantation followed by thermal oxidation. The oxide thickness has been demonstrated to be larger in the amorphized region when compared to the unimplanted (monocrystalline SiC) region. The breakdown field strength of this oxide (8 MV/cm) is comparable to that obtained for thermal oxide grown on silicon. C-V measurements indicate the presence of large negative charge in the oxide grown using this method.<>
Keywords :
amorphous semiconductors; characteristics measurement; electric strength; insulated gate field effect transistors; ion implantation; oxidation; power transistors; semiconductor materials; silicon compounds; 6H-silicon carbide; C-V measurements; SiC; breakdown field strength; growth rates; high dose ion implantation; large negative charge; oxide thickness; thermal oxidation; thick amorphous layer; Amorphous materials; Amorphous silicon; Argon; Implants; Ion implantation; Oxidation; Plasma temperature; Silicon carbide; Substrates; Thickness measurement;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.320989
Filename :
320989
Link To Document :
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