DocumentCode
1174031
Title
Fabrication of metal gated FinFETs through complete gate silicidation with Ni
Author
Kedzierski, Jakub ; Ieong, Meikei ; Kanarsky, Thomas ; Zhang, Ying ; Wong, H-S Philip
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
51
Issue
12
fYear
2004
Firstpage
2115
Lastpage
2120
Abstract
Metal-gate FinFETs were fabricated using complete gate silicidation with Ni, combining the advantages of metal-gate and double-gate transistors. NiSi-gate workfunction control is demonstrated using silicide induced impurity segregation of As, P, and B over a range of 400 mV. High device performance is achieved by integrating the NiSi metal gate with an epitaxial raised source/drain, silicided separately with CoSi2. Process considerations for this dual silicide integration scheme are discussed. Poly-Si gated FinFETs are also fabricated and used as references for workfunction and transconductance.
Keywords
MOSFET; cobalt compounds; nickel compounds; As; B; CoSi2; NiSi; NiSi-gate workfunction control; P; double-gate transistors; dual silicide integration scheme; epitaxial raised source/drain; gate silicidation; metal gated FinFET; metal-gate transistors; poly-Si gated FinFET; silicide gate; silicide induced impurity segregation; transconductance; transistor scaling; ultrathin body; undoped body; workfunction engineering; Dry etching; FinFETs; Hafnium; Immune system; Impurities; MOSFETs; Optical device fabrication; Silicidation; Silicides; Transconductance; 65; DG; Double gate; FUSI; FinFET; NiSi; fully silicided; gate workfunction; metal gate; silicidation; silicide gate; thin body; transistor scaling; ultrathin body; undoped body; workfunction engineering;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2004.838448
Filename
1362976
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