• DocumentCode
    1174031
  • Title

    Fabrication of metal gated FinFETs through complete gate silicidation with Ni

  • Author

    Kedzierski, Jakub ; Ieong, Meikei ; Kanarsky, Thomas ; Zhang, Ying ; Wong, H-S Philip

  • Author_Institution
    IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
  • Volume
    51
  • Issue
    12
  • fYear
    2004
  • Firstpage
    2115
  • Lastpage
    2120
  • Abstract
    Metal-gate FinFETs were fabricated using complete gate silicidation with Ni, combining the advantages of metal-gate and double-gate transistors. NiSi-gate workfunction control is demonstrated using silicide induced impurity segregation of As, P, and B over a range of 400 mV. High device performance is achieved by integrating the NiSi metal gate with an epitaxial raised source/drain, silicided separately with CoSi2. Process considerations for this dual silicide integration scheme are discussed. Poly-Si gated FinFETs are also fabricated and used as references for workfunction and transconductance.
  • Keywords
    MOSFET; cobalt compounds; nickel compounds; As; B; CoSi2; NiSi; NiSi-gate workfunction control; P; double-gate transistors; dual silicide integration scheme; epitaxial raised source/drain; gate silicidation; metal gated FinFET; metal-gate transistors; poly-Si gated FinFET; silicide gate; silicide induced impurity segregation; transconductance; transistor scaling; ultrathin body; undoped body; workfunction engineering; Dry etching; FinFETs; Hafnium; Immune system; Impurities; MOSFETs; Optical device fabrication; Silicidation; Silicides; Transconductance; 65; DG; Double gate; FUSI; FinFET; NiSi; fully silicided; gate workfunction; metal gate; silicidation; silicide gate; thin body; transistor scaling; ultrathin body; undoped body; workfunction engineering;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2004.838448
  • Filename
    1362976